With the development of high-performance and multi-functional electronic components, high-frequency and high-speed signal transmission is brought.
Compared with the characteristics of conventional circuit board products, high-rise circuit board has the characteristics of thicker board, more layers, more dense lines and vias, larger unit size, thinner dielectric layer, etc., and the requirements of inner space, inter layer alignment, impedance control and reliability are more stringent.
In fact, the blistering of circuit board surface is the problem of poor bonding force of board surface, which further extends to the problem of surface quality of board surface, including two aspects
For electronic equipment, some heat will be generated during operation, so that the internal temperature of the equipment will rise rapidly.
"Cleaning" is often ignored in PCBA manufacturing process, and it is considered that cleaning is not the key step.
Hot air leveling is to immerse PCB into molten solder (63Sn / 37Pb), and then blow off the excess solder on PCB surface and metallized hole with hot air to obtain a smooth, uniform and bright solder coating layer
PCB has single-sided, double-sided and multi-layer. For radio and other simple appliances, single-sided PCB can be used.
In recent years, driven by the new energy vehicle policy, the sales volume of new energy vehicles in China has increased significantly.