Via is one of the important parts of multi-layer PCB. The cost of drilling usually accounts for 30% to 40% of the cost of PCB manufacturing.
There are signs of growth in technology in almost all of the world's leading industries. One of them is the upgrading of mobile technology.
Cause analysis of copper free in PCB hole copper deposition using different resin system and material base plate, different resin system will lead to significant difference in activation effect and copper deposition.
When hot liquid solder dissolves and penetrates into the surface of the metal to be welded, it is called metal tin or metal tin.
With the development of electronic industry, the integration degree of electronic components is higher and higher, and the volume is smaller and smaller, and BGA type packaging is widely used.
Such as input / output, AC / DC, strong / weak signal, high frequency / low frequency, high voltage / low voltage, etc.