An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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Advantages
● Smaller components.
● Much higher component density (components per unit area) and many more connections per component.
● Components can be placed on both sides of the circuit board.
● Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.
● Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads. (On the other hand, through-hole components cannot be slightly misaligned, because once the leads are through the holes, the components are fully aligned and cannot move laterally out of alignment.)
● Better mechanical performance under shock and vibration conditions (partly due to lower mass, and partly due to less cantilevering)
● Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
● Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.[8]
● Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
● Lower initial cost and time of setting up for mass production, using automated equipment.
● Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
● Many SMT parts cost less than equivalent through-hole parts.
