The RoHS PCB assembly process requires that none of the hazardous materials listed in the RoHS Directive are used in the boards, components or solders.
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ABOUT US
The Lead free SMT Assembly Process
The RoHS PCB assembly process requires that none of the hazardous materials listed in the RoHS Directive are used in the boards, components or solders. Bare printed circuit boards used in the typical "leaded process" are often coated with a lead-tin finish, so the finish on the board must be modified significantly to be compliant with lead-free and RoHS standards.
The lead-free prototype process also requires that boards to be assembled at higher temperatures usually 30-50 degrees or higher. The higher temperature may require the substrate of the circuit board itself and various components to be modified to withstand the higher temperatures in the oven. In addition, the IC moisture sensitivity level that indicates how long the board can be exposed to the air is approximately 2 classes higher for lead-free boards. The shelf life of the materials used in lead-free boards may also be shorter.
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PRODUCTION LINE
Lead-Free Service
Our Lead-Free services include:
● Lead Free Printed Circuit Boards
● Lead Free Rework
● Lead free Assembly (SMT or THA)
● Lead Free Wave Soldering
● Lead-Free Materials Analysis
